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1. APSS
Applications Processor Subsystem,即应用处理器子系统 (主CPU处理器),ARM的A系列内核,现在一般是8核,负责应用处理。
2. RPM
Resource Power Manager,即电源管理器,ARM的M系列内核,负责给各子系统供电。
3. MPSS
Modem peripheral subsystem,即基带内存子系统,ARM的A系列或DSP的内核;片上内存OCIMEM,运行时会作为RAM
使用,调制解调器负责处理通讯相关业务。
4. WCNSS
Wireless connectivity subsystem,即无线连接子系统,ARM的内核,负责Wi-Fi、BT、GPS、FM等无线相关业务。
5. LPASS
Low-power audio subsystem,即低功耗音频子系统,Hexagon DSP的内核,负责音频、传感器等业务。
各子系统之间,子系统与外设之间需要频繁处理大量复杂的数据和信号,因此催生出各式各样,不同标准的接口。不同平台所用接口也有所不同。
如AP和Memory之间的EMI、UFS、SDIO接口;
AP与摄像头、触摸屏之间的MIPI CSI、DSI接口;
AP与外设传感器之间的I2C、SPI接口;
AP与Codec、Audio PA之间的I2S、PCM/TDM、I2C、SPI、Soundwire、DMIC/PDM接口;
Modem与RFIC之间的Qlink、DigRF、LVDSRF、RFFE MIPI接口;
AP与WBG之间的PCIe、SDIO、UART、SLIMbus、I2S接口;
PMU与外围电源器件之间的I2C、SPMI、SPI、PWM接口;
以及Debug用的JTAG、USB、UART接口等。